JOVY RE-8500 RE8500 BGA Rework Station Also Have RE7500 LY IR6500 IR6000 IR9000 in Stock

1.JOVY RE-8500 RE8500 2.BGA Rework Station 3.Also Have RE7500 IR6500 IR9000 4.Shipping by DHL/EMS/Fedex 5.220V 50/60Hz

JOVY RE-8500 RE8500 BGA Rework Station Also Have RE7500 LY IR6500 IR6000 IR9000 in Stock

1.JOVY RE-8500 RE85002.BGA Rework Station3.Also Have RE7500 IR6500 IR90004.Shipping by DHL/EMS/Fedex5.220V 50/60Hz

Features

• BGA rework Multiple profiling options (standard lead-free, standard leaded and user define).

• Wide lower heating area (500mmx 450mm).

• Five channels thermocouple real time temperature reading.

• Process & profile analyzer for complete process study and control.

• Accurate temperature readings of +/- 2°C.

• Alarm set point to increase the process safety and control.

• Equipped with many types of reflectors for focusing and spotting the upper heater heating area.

• Password protection for data and settings lock.

• High ramp preheating and reflow up to 2.5°C/sec.

• Optimum heating with 3 controlled heating zones.

• Ideal application cooling phase in two methods optionally direct and indirect air flow, adjustable airflow power fan.

• All Windows multi lingual OS.

Specifications

Dimensions L x W x H	520mm x 600mm x 310mm
Working depth	220 mm
Power supply	230 V AC, 50/60 Hz,16 A
Installed heating power	Total 3600 Watt. Upper heater power is 600W & Lower heaters power are 3000W
Upper heater size	60mm x 120 mm one zone
Bottom heater size	340mm x 280mm ,2 separate heating zones
Distance of Upper heater to PCB	Standard is 60 mm , range from 30mm to 80mm
Distance of Lower heater to PCB	35 mm
Temperature sensor channels	5 x k-type thermocouple (potential free) 2 main and 3 optional
Maximum component size PL	120mm x 60 mm
Control	via PC with Jovy control room USB 2.0
Operating Systems	Windows XP® or Windows Vista® Windows7®

Software features

• Interactive and Easy to use Interface.

• Multi-languages interface.

• Fast USB 2.0 connection.

• Profiles:

Profiles Creation: where the user can create standard profiles or free profiles then download it to RE-8500 memory or save it on PC.

Profiles Editing: user can load any pre-saved profile on PC and edit its parameters.

Profile manager mode: where the user will be able to import, edit, delete and save the profiles saved on RE-8500 memory could be re-download it to RE-8500.

Retrieve any profile stored in RE-8500 memory to run it through the interface.

• Processes:

Run manual processes or pre-saved Profile process.

Monitoring heat distribution on PCB by drawing thermo-couples reading on different five positions in a real time.

Do analysis on run process thermo-couples reading in real time.

Save unlimited number of run process graphs and data (thermo-couples reading) files.

Complete process thermal behavior analysis tool.

• Upgrade RE-8500 firmware through Software through USB 2.0 connection.

• Full Control of all RE-8500 peripherals like fan, pump and laser.

• Support Celsius and Fahrenheit temperature unit standards.

Offline mode: Can create profiles and analyze run process data files without connecting RE-8500.

Field of Application

Business field

• Laptop and mother boards rework and repair.

• Game consoles applications rework and repair.

• Small and medium size electronics assembly factories.

• Military sophisticated applications rework and repair.

• Medical equipment applications rework and repair.

• Automotive applications rework and repair.

• Light systems and LED applications.

• Home appliance and personal Gadgets applications rework and repair.

• Networking and communication applications rework, repair and assembly.

• Power supply and control PCB applications rework, repair and assembly.

Components type

• BGA on Flex printed circuit.

• PTH connectors, card slots and sockets.

• Metal components housing.

• Micro lead frame.

• PBGA with heat sink.

• Processor plastic sockets.

• Metal Shielding.

• CSP and fine pitches BGA.

• Plastic PLCC.

• Through hole sockets.

• Heavy Mass CCGA & CBGA.

• Underfill or epoxy coated components.

• QFN, VQFN and advanced design QFN.

• Package over package (POP).

Thanks for your kind attention!